Curable adhesive splints and methods
US6716186B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2000 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Aug 16, 2020 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F5/058
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Curable adhesive splints, methods of manufacturing the splints and methods of using the splints are disclosed. The splints include a curable splinting layer and an exposed pressure sensitive adhesive proximate a first major side of the splinting layer. The pressure sensitive adhesive is used to secure the curable layer in position to provide the desired immobilization. The curable splinting layer may be of any material that can be shaped and cured to provide the desired level of stiffness required for immobilization, such as, e.g., moisture-curable splinting material, etc. The curable adhesive splints may be molded or formed to a desired shape while still providing the stiffness required for immobilization after curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.