Patent · US Expired

Methods and apparatuses for detaching components adhesively bonded to one another

US6716297B2 · kind B2 · utility

5Cited by

19References

36Claims

0Family size

Assignee

Daimlerchrysler AG · US

Inventors

Oliver Essig · Winnenden, DE
Martin Hartweg · Erbach, DE
Anja Keller · Blaustein, DE
Silvia Tomaschko · Ulm, DE

Key dates

Filing date	Mar 16, 2000
Grant date	Apr 6, 2004
Priority date	—
Expiry date	Mar 16, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1922
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The invention relates to methods and apparatuses for separating components adhesively bonded to one another wherein transmitters for mechanical vibrations, in particular for ultrasound, and/or for electromagnetic radiation, in particular laser light, are placed in the region of an adhesive join between the components. An adhesive bond in the adhesive join is acted upon by the vibrations or radiation, and the adhesive and optionally one of the components joined therewith are excited, as a result of which the adhesive effect of the adhesive bond is at least reduced. Alternatively or in addition thereto, transmitters can also be permanently placed in the region of the adhesive join at the time the components are adhesively bonded.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.