Hot-melt-type adhesive in the form of a granulate

US6716527B1 · kind B1 · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

• Michael Czmok · Dormagen, DE
• Rainer Vogel · Langenfeld, DE
• Michael Kik · Langenfeld, DE
• Stephen Hatfield · Somerville, US
• Gerald Petry · Hückelhoven, DE

Key dates

• Filing date: Jan 9, 2002
• Grant date: Apr 6, 2004
• Expiry date: Jul 6, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/2998
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A hotmelt adhesive is provided in the form of a granulate comprising at least one compact outer layer (shell) made up of at least one component which is not pressure sensitive up to 45° C. and which surrounds a core made up of other components of the hotmelt adhesive. The hotmelt adhesive granulates are free flowing even after storage at a high temperature under pressure.