Patent · US Expired

Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof

US6716673B2 · kind B2 · utility

10Cited by

10References

5Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Guenther Waitl · Regensburg, DE
Franz Schellhorn · Regensburg, DE
Herbert Brunner · Sinzing, DE

Key dates

Filing date	May 15, 2002
Grant date	Apr 6, 2004
Priority date	—
Expiry date	Sep 2, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.