Urethane oligomer, resin compositions thereof, and cured article thereof
US6716892B1 · kind B1 · utility
8Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2001 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Sep 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a new urethane oligomer (A) and a resin composition comprising (A) and an unsaturated group containing polycarboxylic acid resin (B) that can be diluted with water and is excellent in providing a cured product and that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.