Conductive composite formed of a thermoset material
US6717057B1 · kind B1 · utility
10Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2001 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Dec 14, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2379/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrically conductive multilayer composite comprises first and second polymeric films, each being flexible and having upper and lower surfaces, with the second film being thermoformable at temperatures at and above its glass transition temperature. A flexible electrically conductive layer is applied to the upper surface of the first film, and an adhesive interlayer adheres the lower surface of the first film to the upper surface of the second film. The adhesive interlayer has elastic properties sufficient to accommodate relative movement between the thus adhered films occasioned by flexure of the composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.