Circuit board consisting of at least two individual circuit board layers made of plastic
US6717060B2 · kind B2 · utility
8Cited by
18References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2001 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | May 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board (5) is described, consisting of at least two individual circuit board layers (10) made of plastics and produced by formation technique, which each have first and second functional sides and at least one microstructured positioning formation (16) on each of the first and second functional sides and at least one microstructured conductor trench (12) on one of the functional sides, the conductor trench (12) being provided with a metallization (18). This allows a low expenditure production of circuit boards having a high packing density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.