Laser sintering apparatus
US6717106B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Oct 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/32341
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser sintering apparatus for realizing high-speed and high-precision forming. When a first position of an exposure unit is decided by an XY-positioning mechanism, a micromirror of a DMD is turned on and off in accordance with image data in a region corresponding to the first position and a laser beam in a predetermined region including ultraviolet is supplied to the DMD and modulated for each pixel in accordance with image data. A laser beam reflected in the direction of a reflection mirror is reflected therefrom in the direction of a surface of a powdered body. A region having a predetermined area on the surface of the powdered body is exposed by the laser beam, and the exposed portion is thereby cured. Similarly, by repeating movement of and exposure with the exposure unit, the entire surface of the powdered body is exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.