Integrated semiconductor circuit
US6717261B2 · kind B2 · utility
1Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Jul 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated semiconductor circuit including a substrate and at least one microwave circuit area supported by a substrate is provided, at least one cooling area supported by the substrate being provided for cooling the microwave circuit area, the at least one cooling area having electric contacts and regions having different types of doping so that cooling may be accomplished by the Peltier effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.