Integrated balun and transformer structures
US6717502B2 · kind B2 · utility
20Cited by
3References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 5, 2001 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Nov 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An on-chip signal transforming device includes a substrate and a first conductive layer above the substrate, wherein the first conductive layer has a plurality of interleaved inductors. The device further includes a second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.