Heat dissipation assembly
US6717814B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 6, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Nov 6, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation assembly includes a fan (10), a mounting bracket (20), a clip (30), a heat sink (40), and a mounting frame (50). The fan is mounted to the mounting bracket. The clip is bent from an elongated thread or rod of wire or suitable wirelike material. The clip includes a central horizontal part (302), and a pair of resilient arms (304) extending perpendicularly from opposite ends of the horizontal part. A groove (402) is laterally defined through parallel fins (403) of the heat sink, and receives the horizontal part of the clip therein. The combined fan and mounting bracket is attached to the combined heat sink and clip to form a subassembly. Thus, the clip is secured in the heat sink in advance. The subassembly is received in the mounting frame. Two apertures (504) of the mounting frame respectively engagingly receive two hooks (306) of the resilient arms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.