Heat dissipation module and its fixed member
US6717815B2 · kind B2 · utility
6Cited by
6References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 18, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Jun 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation module and its fixed member. The fixed member is disposed on a main board and is provided with a base. The base is provided with a plurality of protrusions. Each of the protrusions is provided with a flange. By means of the flange, the protrusion is engaged with a fixed hole disposed on the main board. Alternatively, the base is provided with a plurality of engaging portions. By means of the engaging portions, the protrusion is engaged with the fixed hole disposed on the main board so that the fixed member is fixed on the main board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.