Fabrication of devices with fibers engaged to grooves on substrates
US6719608B1 · kind B1 · utility
2Cited by
20References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | May 17, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/2826
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Fabrication techniques for polishing fibers engaged in grooves on substrates. A protection template assembly is disclosed to protect the unpolished portions of fibers. Chemical mechanical polishing may be used to achieve high fabrication throughput and high polishing uniformity. Optical monitoring may be used to monitor the polishing in real time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.