Polishing composition
US6719819B2 · kind B2 · utility
10Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Oct 28, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/84
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
For aluminum disks and glass-made hard disks, those disks having a mean waviness of less than 3 å are being desired in order to increase the density of memory capacity. The present invention provides polishing compositions that can give smoothly polished surfaces for the disks. The polishing compositions are polishing compositions for aluminum disks or substrates having silica on the surface thereof, which contain colloidal silica particle groups having different particle size distributions and have a SiO2 concentration of 0.5 to 50% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.