Patent · US Expired

Injection molding method and apparatus for underlaying a top materials with plastic

US6719938B2 · kind B2 · utility

3Cited by
1References
26Claims
0Family size

Inventor

Key dates

Filing dateJul 16, 2001
Grant dateApr 13, 2004
Priority date
Expiry dateNov 25, 2021

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C2045/14188
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

An injection molding apparatus for underlaying a flexible top material with plastic inside a cavity, which is formed between a female mold core plate and a mold core, with a dipping edge on the female mold side and another dipping edge on the mold core side, which bound a dipping edge gap that adjoins the cavity, into which gap the top material situated in the cavity extends. The dipping edge on the female mold side is formed on a dipping edge slider that is movably mounted on the female mold plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.