Monomer for chemical amplified photoresist compositions
US6720430B2 · kind B2 · utility
9Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Jul 8, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07D307/88
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The present invention discloses a compound having the following formula (I), wherein R1 is H, haloalkyl group or C1-C4 alkyl group; R2 is hydroxyl group, C1-C8 alkoxy group or C1-C8 thioalkyl group; G is (CH2)n, O or S, wherein n is 0, 1, 2, 3 or 4; Rc is a lactone group; and m is 1, 2 or 3. This compound is a monomer and suitable for synthesis to form polymers with good hydrophilicity, adhesion and dry-etch resistance. Particularly, this compound can form photosensitive polymers or copolymers by reacting with suitable photosensitive monomers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.