Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6720493B1 · kind B1 · utility
14Cited by
67References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose an integrated circuit die within, wherein the lid and the base are each constructed from a high Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high Z material disposed between the integrated circuit die and the base, in combination with a high Z material lid to substantially block incident radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.