System and method of laser drilling
US6720519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Sep 23, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/162
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.