Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
US6720522B2 · kind B2 · utility
32Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2001 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Oct 25, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a laser beam machining method, a liquid, through which a laser beam can be transmitted, is supplied to the target surface of an object to be processed. A laser beam is guided to the target surface through the liquid. The laser beam processes the target surface under the application of ultrasonic vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.