Method and apparatus for laser drilling
US6720524B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 5, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Apr 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polygon mirror 11, a mask 12 having a row of holes for defining a processing pattern, a galvano-mirror 16, and a processing lens 17are arranged in that order between a laser oscillator 10 and a printed circuit board 20 as a workpiece, and the laser beam from the laser oscillator 10 is projected onto the printer circuit board 20 traveling through these components. The polygon mirror 11 sweeps the laser beam so that the laser beam scans the holes of the mask 12 for the mirror on each face, and a plurality of holes are thereby formed into the printed circuit board 20. The irradiation region of the laser beam to the printer circuit board 20 is shifted in one axis direction by the galvano-mirror 16.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.