Circuit card module including mezzanine card heat sink and related methods
US6721182B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Oct 10, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/76
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit card module to be received in a card chassis includes a host card assembly and a mezzanine card assembly carried in spaced relation by the host card assembly. The host card assembly includes a host card heat sink having an end to connect to the card chassis to conduct heat thereto, and a host circuit card mounted on the host card heat sink. The mezzanine card assembly includes a mezzanine card heat sink, and a mezzanine circuit card mounted on the mezzanine card heat sink. The mezzanine card heat sink has an end to connect to the card chassis to conduct heat thereto in parallel with heat conducted from the host card heat sink to the card chassis. The mezzanine card heat sink may comprise a body adjacent the mezzanine circuit card, and a flexible strap extending outwardly therefrom to connect to the card chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.