Semiconductor memory chip module
US6721196B1 · kind B1 · utility
48Cited by
9References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 22, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Mar 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a semiconductor memory chip module (2′) for a smart card, a nonvolatile memory chip (EEPROM) (4) and a volatile memory chip (SRAM) (6) are stacked and coupled directly by vertical chip interconnections (16). The rapid-access volatile memory permits fast execution of programs. Permanent and safe storage of data is effected by reloading the data to the nonvolatile memory. A chip (8) with decoder circuits can be contained in a further level. Likewise integrated into a chip is a buffer capacitor (20) which is constantly recharged to a constant supply voltage during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.