Mounting structure for semiconductor laser module
US6721341B2 · kind B2 · utility
5Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Apr 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02476
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser module is packaged on a mounting substrate through a thermal diffusion sheet member. The thermal diffusion sheet member is that having thermal conductivity where thermal conductivity in the surface direction is greater than that in the thickness direction. Specifically, the thermal diffusion sheet member is graphite, for example, and has a thermal conductivity of 300 W/m·K or greater in the surface direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.