Implantable medical device assembly and manufacturing method

US6721602B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• David B. Engmark · Bethel, US
• Thomas Ceballos · La Petite Bellangeraie, US
• Richard A. Bruchmann · Andover, US
• Kevin K. Tidemand · East Bethel, US
• George Patras · Greenfield, US
• Todd Schaefer · Circle Pines, US
• Robert L. Olson · Vadnais Heights, US

Key dates

• Filing date: Aug 21, 2001
• Grant date: Apr 13, 2004
• Expiry date: Jan 8, 2022

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61N1/375
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

In general, the invention is directed to an implantable medical device assembly having a more space-efficient housing and components, as well as processes for assembling the implantable medical device with reduced assembly cost and less complexity. The implantable medical device may incorporate a battery, capacitor, circuit assembly, feedthrough assembly, and interconnect assembly with respective electrical terminals. This configuration permits the use of automated electronic module assembly techniques such as parallel gap or ribbon bond welding to electrically connect the terminals. A feedthrough assembly may present a set of terminals adjacent a corresponding set of circuit terminals, also enabling the use of automated welding techniques.