Method of soldering metallic terminals
US6722558B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Jul 31, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/38
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system and method of joining together first and second electric terminals includes providing the second terminal with an aperture extending therethrough and a notch therein. The first and second terminals are positioned in overlapping relationship with one another so the aperture overlaps the first terminal to provide access to the first terminal through the second terminal, and so the notch overlaps the first terminal. Heat is applied to the first terminal through the aperture in the second terminal to heat the first and second terminals. The end of a solder wire is positioned in engagement with the notch of the heated second terminal to locate the solder wire with respect to the terminals and to melt the solder wire to form a solder pool that contacts the first and second terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.