Divisible module card which is resistant to bending stresses
US6722571B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Jul 7, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07728
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This invention concerns a card with a plastic card body (2) and a snap-off module (3) held to the said card body (2), by three ties (12, 13, 14), this snap-off module (3) including, firstly, a substantially rectangular thin plastic body (4) of which one edge (6) in the corner is cut so as to form a means of foolproofing and, secondly, a microcontroller electrically connected to contact pads (5) flush with the surface of the said module (3). The card (1) according this invention is characterized in that a first tie (12) connects the cut foolproofing edge (6) of the module (3) to the card body (2). The invention applies in particular to ISO format smartcards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.