Patent · US Expired

High temperature modeling apparatus

US6722872B1 · kind B1 · utility

417Cited by
7References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 13, 2001
Grant dateApr 20, 2004
Priority date
Expiry dateAug 19, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S264/57
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Disclosed is a three-dimensional modeling apparatus (10) that builds up three-dimensional objects in a heated build chamber (24) by dispensing modeling material from a dispensing head (14) onto a base (16) in a pattern determined by control signals from a controller (140). The motion control components (18, 20) of the apparatus (10) are external to and thermally isolated from the build chamber (24). A deformable thermal insulator (132) forms a ceiling of the building chamber, allowing motion control of the dispensing head (14) in an x, y plane by an x-y gantry (18) located outside of and insulated from the build chamber (24). In the preferred embodiment, a material dispensing outlet (66) of the dispensing head is inside the chamber. Thermal isolation of the motion control components from the build chamber allows the chamber to be maintained at a high temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.