Retention mechanism for an electrical assembly
US6722908B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2003 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Jan 2, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7047
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.