Method of producing structured wafers

US6723250B1 · kind B1 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Joerg Schaefer · Rheinbach, DE
• Peter Linke · Jena, DE
• Albrecht Schwille · Reutlingen, DE
• Helmut Baumann · Gomaringen, DE

Key dates

• Filing date: Jan 27, 1999
• Grant date: Apr 20, 2004
• Expiry date: Jan 27, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/958
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method of producing structured wafers guarantees that the edge of the wafer will be protected from attack by an aggressive etchant medium without applying a photoresist to the edge and without using additional mechanical measures. In a type of negative process, a passivation layer is applied to the areas that are not to be structured, including the edge area of the wafer.