Semiconductor encapsulating epoxy resin composition and semiconductor device
US6723452B2 · kind B2 · utility
3Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Jul 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.