Method and apparatus for attaching solder members to a substrate
US6723629B2 · kind B2 · utility
7Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Jul 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0525
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention discloses a method for attaching solder members (114) to a substrate (112). The method includes forming a decal (110) with a plurality of solder members (114). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder members (114) on the decal (110) to the substrate (112).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.