Optical attenuating underchip encapsulant
US6724015B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Mar 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus are provided for providing an electro-optic interface for exchanging information signals. The method includes the steps of disposing an optical array adjacent a first side of an optically transparent substrate, such that a plurality of transmission paths of the optical array pass directly through the substrate, applying an optically transparent underfill between the substrate and adjacent optical array with the plurality of transmission paths of the optical array passing directly through the underfill and coupling a plurality of optical signals of the optical array through the optically transparent underfill and optically transparent substrate between the optical array and an optical connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.