Semiconductor package having multi-signal bus bars
US6724077B2 · kind B2 · utility
1Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2001 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Mar 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.