Wire bond-less electronic component for use with an external circuit and method of manufacture
US6724079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Jan 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate (110, 410), an electronic device (130) over the support substrate, and a cover (140, 440, 540) located over the electronic device and the support substrate. The cover includes an interconnect structure (141, 441, 541) electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit for providing impedance transformation of an electrical signal between the electronic device and the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.