Flip-chip system and method of making same
US6724091B1 · kind B1 · utility
16Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Oct 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.