Method of fabricating array substrate for use in an in-plane switching mode liquid crystal display device
US6724453B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 9, 2001 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Dec 12, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/136213
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of fabricating an array substrate (as well as an array substrate itself) for use in an IPS-LCD device prevents a short-circuit between a data line and a storage capacitor. When fabricating the array substrate for use in the IPS-LCD device, the residues of a third metallic material, which remains in step portions of the double-layered common line, cause a short-circuit between a data line and a storage capacitor. In order to prevent the short-circuit, a plurality of protrusions extending from a first layer of the double-layered common line are formed at both sides of the storage capacitor. The plural protrusions have quadrilateral-shaped holes in their central portions. By forming an etching hole at each corner of the protrusion and eliminating the residues using the etching hole, the short-circuit between the storage capacitor and the data line is obviated. Accordingly, the IPS-LCD device having a high resolution is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.