Manufacturing method for a thin-film high-pressure sensor
US6725724B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 20, 2001 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Jul 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49007
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for manufacturing a sensor component, in particular, a thin-film high-pressure sensor, as well as a sensor component, is described, in which at least one measuring element, in particular an expansion measuring strip is arranged on a membrane, and separated from the membrane through an electrically insulating film, the measuring element being arranged on an electrically insulating substrate, which is mounted in a subsequent step onto the membrane on the side that faces away from the measuring element, so that the electrically insulating substrate forms the electrically insulating film. The electrically insulating substrate performs both a carrier function during the application of the expansion measuring strip to the substrate as well as an insulation function after the mounting of the substrate onto the membrane. In this way, the application of a separate insulation film made of silicon dioxide becomes unnecessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.