Method for polishing leads for semiconductor packages
US6726533B2 · kind B2 · utility
0Cited by
8References
7Claims
0Family size
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Inventor
Key dates
| Filing date | Nov 28, 2001 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Nov 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a method for polishing leads of a semiconductor package, a plurality of semiconductor packages is arranged in a certain manner. Then, the leads are automatically polished. The semiconductor packages may be masked to expose at least a part of the leads to be polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.