Process for fabricating a coating layer on a portable support, particularly a card format support, and portable support provided with such coating layer
US6726959B1 · kind B1 · utility
0Cited by
10References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1998 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Nov 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for fabricating a coating layer (8) and a portable support (1) provided with such layer, comprising a support body (3) provided on one of its sides (4) with said coating layer (8). The process of the invention is characterized in that, for the fabrication of the coating layer (8), a transient thermoplastic layer (17) is cross-linked so as to make it thermosettable. The invention applies particularly to the fabrication of chip based cards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.