In-mold labels and uses thereof
US6726969B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1997 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Jun 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to an in-mold label comprising a core layer with a first and second surface and a heat seal layer on the first surface of the core layer, wherein the heat seal layer comprises a polyolefin, having a peak melt temperature of less than about 110° C. and where less than about 25% of the polyolefin melts at a temperature of less than 50° C. as measured by differential scanning calorimetry. The label may also contain a skin layer on the second surface of the core layer. The invention also relates to plastic substrates bonded to the label. In another aspect, the present invention also relates to a process for in-mold labeling and a process for preparing an in-mold label.The labels and processes provide reduced amounts of one or more of the following: blisters, both before and after bonding, shrinkage, bagginess and gage bands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.