Process for fabricating an electronic component incorporating an inductive microcomponent
US6727138B2 · kind B2 · utility
3Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2002 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Nov 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for fabricating electronic components incorporating an inductive microcomponent placed on top of a substrate. Such a component comprises: a layer (10) of material having a low relative permittivity, lying on the top face of the substrate (1); a number of metal turns (30-31) defined on top of the layer (10) of material having a low relative permittivity; and a copper diffusion barrier layer (15) interposed between the metal turns (30-31) and the layer of material having a low relative permittivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.