Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound
US6727325B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1999 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Jun 23, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/621
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula [I]; wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R1 to R8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula [I] shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.