Heat sink/heat spreader structures and methods of manufacture
US6727422B2 · kind B2 · utility
46Cited by
18References
71Claims
0Family size
Inventor
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Oct 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.