Planar band gap materials
US6727863B2 · kind B2 · utility
3Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2001 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Nov 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q15/14
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates to planar materials having bandgap properties. The materials are formed by depositing conductive fractal patterns on a non-conducting substrate. The bandgap location(s) are defined by parameters including the number of fractal levels, and the dimension of the fractal mother element. The bandgaps can also be actively controlled by injecting current into the conducting pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.