Head gimbal assembly interconnecting leads having improved robustness and lower stiffness
US6728068B1 · kind B1 · utility
2Cited by
15References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1999 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Aug 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10848
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit for use in a head gimbal assembly having low stiffness and high robustness. The flexible interconnect circuit has interconnecting leads which connect the flexible interconnect circuit to a transduction head. To ensure the transducing head is able to follow the surface of the disc and properly read from and write to the disc, the interconnect leads are constructed with a varying width. The leads are widened at the points where breakage usually occurs and are narrowed at a middle portion to ensure the leads maintain the desired flexibility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.