Heat dissipation structure of integrated circuit (IC)
US6728106B2 · kind B2 · utility
3Cited by
6References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 13, 2002 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Mar 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure of an IC includes a circuit board provided with through holes perforated thereinto, an IC mounted on the upper surface of the circuit board, a solder filling a space between the circuit board and the IC via the through holes and being cured, and solder lands formed on the circuit board and attached with the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.