Method for making a sonoprobe
US6729001B2 · kind B2 · utility
2Cited by
18References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1999 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Jul 7, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1057
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for the fabrication of a multielement acoustic probe. A flexible circuit having conducting tracks on at least one of its sides is used. This circuit is joined to a plate of piezoelectric material having metallizations. Vias are produced through the flexible circuit in order to address the metallizations and to produce electrical contacts within the vias. This process may be used in echography probes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.