Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material
US6729023B2 · kind B2 · utility
0Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2001 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Mar 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.