Apparatus and method for drying a substrate using hydrophobic and polar organic compounds
US6729040B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2001 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Mar 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dryer for drying a substrate includes: a bath containing a fluid; a chamber; and a delivery system supplying a polar organic compound, such as isopropyl alcohol, and a hydrophobic organic compound, such as hydrofluoroether, to the interface between the substrate and the fluid as the substrate is removed from the fluid of the bath into the chamber. The dryer further includes a chamber environment control system that supplies a gas into the chamber to dry the substrate and controls temperature and humidity in the chamber and a chamber heater attached to the chamber to transfer thermal energy into the chamber. A drying method includes: immersing a substrate into a fluid contained in a bath; removing the substrate from the fluid into a chamber; and supplying isopropyl alcohol and hydrofluoroether to an interface between the substrate and the fluid. The method further includes: supplying a gas into the chamber to dry the substrate and to control temperature and humidity in the chamber; and heating the chamber to transfer thermal energy into the chamber and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.