Flow sensor in a housing
US6729181B2 · kind B2 · utility
19Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2001 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Aug 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The flow sensor has a first and a second housing section and a semiconductor chip with an integrated sensor element between the housing sections. The semiconductor chip is arranged at a measuring conduit formed by a groove in a first one of the housing sections. A sealing ring is arranged between the housing sections. A flexible support foil carrying strip conductors is connected to the semiconductor chip and extends between the sealing ring and the second housing section out of the housing. This simple arrangement is able to withstand high pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.